High performance X-ray inspection solution

Premium Nanofocus and Microfocus Inspection for Electronics


The Phoenix Microme|x Neo and Nanome|x Neo provide high-resolution 2D X-ray technology, Planar|CT and 3D computed tomography (CT) scanning in one system. 

With innovative engineering coupled with ultra-high positioning accuracy, Phoenix Microme|x Neo and Nanome|x Neo are ideally suited for industrial X-ray electronics inspections in process and quality control for greater productivity, failure analysis for the increased safety and quality of your products, and R&D where innovations are born. Both enable automated X-ray inspection (AXI) of electronic components - such as semiconductors, PCBs, electronic assemblies, sensors and lithium-ion batteries - in industrial, automotive, aviation and consumer electronics industries. 

Non-destructive electronics inspection starts here

Innovative and unique features and an extreme high positioning accuracy make both the Phoenix MicromeIx 160 and 180 neo and the NanomeIx 180 neo the effective and reliable solution for a wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control.   

The Phoenix|x-ray X|act inspection software offers easy to program CAD based µAXI ensuring automated inspection in the micrometer range. Another unique benefit is Waygate Technologies’ rich options of DXR-HD digital detector fleet. There’s definitely a perfect match of image chain serving your particular application.




  • Brilliant live inspection images due to high dynamic Waygate Technologies' DXR digital detector array
  • Unique high power 180 kV / 20 W micro- or nanofocus tube for even high absorbing electronic samples
  • Minimized setup time due to highly efficient automated CAD programming
  • Xe2 toolkit (X-ray image Evaluation Environment), a graphical based development environment for fast measure setups for evaluating X-ray images
  • Best detail detectability 0.5 μm or even 0.2 μm with nanofocus
  • Best in class image processing technologies optimize digital images quickly and constantly
  • Advanced failure analysis with high resolution 3D micro- or nanoCT® or large board Planar|CT
  • Optionally 3D CT scans less than 10 seconds
Unique Features

  • Superior pixel resolution 85 μm, 100 μm and 139 μm new detectors are more competent to semiconductors and micro electronics components inspection
  • X|act package for CAD based µAXI programming and automatic inspection
  • Diamond|window for up to 2 times faster data acquisition at the same high image quality level
  • Optical and X-ray navigation map for fast positioning and easy programming
  • Proprietary OVHM technology enables synchronized motion and ergonomic set up for easy view configuration
  • Flash!Electronics™, Waygate Technolgies' best ever image processing technology specially optimized for Electronics inspection
  • Dose|manager combined with Shadow|target to prevent sensitive devices from radiation damage by reducing unnecessary dose

  • Battery inspection
  • Quality assembly like BGA, Wire sweep, PTH, or QFN/QFP
  • Other components like IGBT or SMD
  • Quality assembly
  • SMT
  • Sensors
  • Control modules
Phoenix Microme|x Neo and Nanome|x Neo - Key Features
Brilliant DXR-HD live imaging
  • Large-size DXR S100 Pro detector in combination with superior pixel resolution defines industry leading imaging technology. Provides superior 100 µm pixel resolution and 30 cm x 25 cm large active area combining outstanding detectability with high inspection efficiency.
  • High dynamic DXR S140 detector with enhanced scintillator technology for precise and fast LIVE inspection. Full frame rate of 25 frames per second at 1536 x 1536 pixels offers low noise coupled with brilliant image quality ensuring fast and detailed live inspection


Flash!Filters BGA inspection
High output with high-resolution: Diamond|window

Compared to conventional beryllium targets, the Diamond|window allows higher power at a smaller focal spot. This ensures high-resolution
even at high output.

  • Up to 2 times faster CT data acquisition at the same high image quality level
  • High output with high-resolution
  • Non-toxic target
  • Improved focal spot position stability within long term measurements
  • Increased target lifetime due to less degradation with higher power density
Phoenix VTX S Diamond Window
High-resolution 3D computed tomography

For advanced inspection and 3D analysis of smaller samples, Phoenix|x-ray’s proprietary 3D CT technology is optionally available.

  • 180 kV / 20 W high power X-ray technology, fast image acquisition with DXR detector and Diamond|window combined with Phoenix|x-ray’s fast reconstruction software deliver high-quality inspection results
  • Maximum voxel resolution down to 2 microns; the nanoCT® capability of the Nanome|x Neo allows higher image sharpness
  • The mechanical precision of the CT rotation units are optimized for highest resolution CT applications
Efficient CAD programming

X|act provides not only a minimal setup time compared to conventional view based AXI – once programmed, the inspection program is portable to all X|act compatible systems. The result is fast and easy programming: just assign the inspection strategies and let X|act generate the automated inspection program

  • Specific inspection strategies for different pad types
  • Fully automated inspection program generation
  • Outstanding precision and repeatability - resolutions of only a few micrometers, 360° rotation, and oblique viewing up to 70°
  • High reproducibility on large PCBs
  • Easy pad identification by its live CAD data overlay function coupled with FLASH!™ image optimization
Nanome|x Operator
Virtual board slicing with Planar|CT

Planar|CT slice or multislice views allow exact inspection results of a single plane or a whole package. 

  • Easy 2D slice or 3D volume evaluation of large complex boards
  • No board cutting, no overlaying structures as in X-ray images
  • New designed workflow, minimize the scan preparation and human interaction with no loss of image quality.
  • User friendly, less product knowledge required to complete a planar CT inspection
Cutting-edge detail detectability, speed, and image quality
  • Brilliant live inspection images with high dynamic Waygate Technologies DXR digital detector array
  • Large 27” monitor and ultra-high defect coverage and repeatability
  • Detail detectability at 0.5 µm or 0.2 µm with nanofocus
  • Live overlay of CAD and inspection results even in rotated oblique inspection views
  • High power 180 kV / 20 W microfocus or nanofocus tube for high absorbing electronic samples
BGA ball Flash optimized
Navigation Map Orientation

Clear overview and fast positioning: 

  • Optical camera image or X-ray overview image for whole sample as navigation map
  • Fast manipulation by clicking on the map
  • Inspection program can be set based on the optical navigation map
  • Position on the map can be saved into test report generated by X|act
AXI Navigation Map
Smart Dose Management

Waygate Technologies´ proprietary Shadow|target inside the X-ray tube enables a reduction of unnecessary radiation dose compared to conventional x-ray tubes during a typical inspection. Combined in a low-dose bundle together with the brand new Dose|manager tool, it enables real-time dose monitoring and controlling

This solution protects radiation sensitive inspected components from aging to worst case damage.

  • Shadow|target reduces unwanted radiation without frequent generator start & stop
  • Fast and stable X-ray recovering. No delay of energy running up
  • Realtime visualization of projected dose through “dose map”  overlaid with Navigation map
  • Cumulated dose calculation per inspection
  • Multi-position dose measurement well integrated into inspection program
  • Comparing with manual inspection, up to 99% radiation dose can be saved combining dose control technologies with automated inspection (programming)
Efficient and transportable for in-field applications
  • Minimized setup time due to highly efficient automated CAD programming
  • Designed for portability with compact, state-of-the-art electronics
  • Intuitive GUI interface with fully automated inspection program generation
Options for optimization and 3D scanning
  • Optional Flash!Electronics™ image processing technology
  • Optional advanced failure analysis with high-resolution 3D micro- or nanoCT® or large board PlanarCT
  • Optional 3D CT scans up to 10 seconds
Phoenix Microme|x Neo and Nanome|x Neo
Learn all about the Phoenix Microme|x Neo and Nanome|x Neo

Next-generation, high-resolution 2D X-ray technology and 3D computed tomography( CT) scanning

What type of tube does the Phoenix Micromex/Nanomex Neo use?

Microme|x Neo offers either a 160KV micro focus tube or a 180KV micro focus tube while Nanome|x Neo is equipped with a 180KV nano focus tube. The diamond window is installed as standard.

Detail detectability at 0.5 µm (Microme|x Neo) or 0.2 µm (Nanome|x Neo).

20W power on target for all tube fleet contributes to high inspection resolution and throughput.

Micro nanofocus X-ray tube scheme
What type of detector is used?

Microme|x Neo and Nanome|x Neo offer various detectors with unique features fulfilling your particular application,

  • 75 µm resolution DXR S85 detector of best performance-price ratio for small components and PCB/PCBA inspection
  • 200 µm resolution DXR 250RT with active cooling of extremely high dynamic range and brilliant image quality ensuring fast and detailed live inspection
  • 139 µm resolution DXR S140 with super fast imaging meeting comprehensive needs of high integrated micro electronics inspection
  • 100 µm resolution large size DXR S100 Pro detector offering outstanding combination of detectability and productivity, perfectly fitting semiconductor and large sample inspection


What is the Max. Inspection Area and the Max. Sample size?

The Max. inspection area of our system is 460 mm x 360 mm (18” x 14”) with a rotation table, and 610 mm x 510 mm (24” x 20”) with an optional X-Y table (non-rotatable)

Max. sample size/weight is 680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.).

Can they both perform 3D inspection ?

Phoenix|x-ray’s proprietary 3D CT technology is optionally available on the Microme|x Neo and Nanome|x Neo for advanced inspection and 3D analysis of smaller samples. Max. geometric magnification could be 100x (CT) and Max. voxel resolution down to 2um, resolution depending on the sample size.

What manual manipulation on images is needed before evaluation?

You need nothing more than one click!

Combining 25+ years of experience and patents with next-generation technology, Waygate Technologies’s intelligent Flash!TM software automatically optimizes your digital radiographs quickly and consistently. The balanced presentation of different densities and materials lets you see all the subtle details in one single image, with no manual adjustments.

And now the newest version specially optimized for electronics, Flash! Electronics, is available!

Image manipulation
Will radiation damage my electronics samples?

Some radiation sensitive electronics such as memory and resistor will get damaged by certain dose. Therefore, the radiation dose needs to be strictly monitored and managed for reducing the quality (inspection) cost as much as possible. Waygate Technologies’ low dose management bundle is a comprehensive solution which combines Shadow|target and Dose|manager enabling dose control from both source end and receptor end.

Dose control is well integrated with inspection programming and fitting various applications.

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