Unlocking New Possibilities with Datos|x 3.1
In this article:
- Introducing Datos|x 3.1 for Advanced CT Imaging: Waygate Technologies’ latest CT software release, Datos|x 3.1, delivers enhanced image quality, faster scan times, and streamlined workflows for industrial inspection.
- Flex|scan for High-Aspect Ratio Samples: The new Flex|scan feature dynamically adjusts magnification during rotation, improving voxel resolution for complex components like PCBs and battery cells.
- Integrated Multi|BHC Artifact Correction: Enhanced cupping and streaking correction is now built into the reconstruction software, with automation support for batch processing and consistent image clarity.
- Improved Data Handling with LDA Enhancements: Users can now merge sub-scans into a single volume, simplifying large dataset management and boosting productivity in high-throughput environments.
- Faster Scanning with DXR S100 Pro Optimization: Upgraded detector read-out speeds significantly reduce scan times, enabling quicker inspections without sacrificing detail or accuracy.
Unlocking New Possibilities with Datos|x 3.1
At Waygate Technologies, we’re always pushing the boundaries of innovation to provide you with the most advanced industrial inspection solutions. With the latest release of our CT operating systems Datos|x 3.1, we’re excited to introduce new features and enhancements designed to improve image quality, increase efficiency, and streamline workflows. Take a closer look at what's new.
Flex|scan: Enhanced Resolution for Complex Samples
Flex|scan introduces a new, flexible trajectory to improve voxel resolution, especially for samples with higher aspect ratios such as PCBs or pouch battery cells. This enhancement allows for more detailed and accurate imaging, enabling better analysis of intricate components.
Flex|scan
During rotation, the magnification is adjusted dynamically. The result is a volume with the voxel size of the highest magnification. For any further process step, the Flex|scan output looks like a standard CT volume, making it compatible with all established evaluation methods.
Before and After: Enhanced Image Quality
Multi|BHC with Preview: Smarter Artifact Correction
Our advanced cupping and streaking artifact correction from the previous stand-alone application is now seamlessly integrated into the Datos|x Reconstruction software. This update includes full automation capabilities using batch programming, allowing you to process multiple scans efficiently while maintaining superior image clarity.
Example result – Concrete sample
Cupping and streaking artifacts:
- Cupping: Density in the middle lower than at the edge
- Streaking: Missing information along metal inclusions
Cupping corrected:
- Density in the middle equal to the edge
Cupping and Steaking corrected:
- Density in the middle equal to the edge.
- Streaking is corrected.
LDA Improvements: Streamlined Data Management
Managing large datasets has never been easier. With the new LDA improvements, you can now merge individual sub-scans into a single volume, simplifying data handling and enhancing workflow efficiency.
DXR S 100 Pro Speed Improvements: Faster Scanning Times
Time is crucial, and with the optimized detector read-out, Datos|x 3.1 significantly reduces scanning times. This enhancement allows for faster inspections without compromising image quality, helping you stay ahead in fast-paced industrial environments.
At Waygate Technologies, we remain committed to advancing industrial inspection with cutting-edge technology. Datos|x 3.1 is a testament to our dedication to precision, efficiency, and innovation.
Stay tuned for more updates as we continue to push the limits of what’s possible in industrial inspection.
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