Non-Destructive X-ray Inspections for Electronics

If you want to inspect predominantly flat and easy-to-penetrate parts such as assembled circuit boards by using X-rays, a microfocus system such as the X|aminer or the Microme|x with more radiation power (180 instead of 160 kV) is the first choice. Thanks to the vertical beam path, with the X-ray tube at the top and the swivelling detector under the manipulation table, the objects to be inspected can simply be put on the inspection table and inspected immediately without fixing - even in oblique viewing at maximum magnification.  

If the defect cannot be detected by 2D X-ray inspection, layer-by-layer laminography or, by using an additional CT rotation unit, full high-resolution 3D CT is also possible as an option.  

If not only solder joints but also semiconductor components with significantly smaller structures are to be inspected, nanofocus X-ray and nanoCT with the Phoenix Nanome|x are the best solution. 

The Phoenix Microme|x neo and Nanome|x neo AXI systems provide high-resolution 2D X-ray inspection and 3D computed tomography( CT) scanning in one system, enabling non-destructive testing (NDT) of electronic components – such as semiconductors, PCBs, lithium-ion batteries - in industrial, automotive, aviation and consumer electronics industries.

With innovative engineering coupled with ultra-high positioning accuracy, Phoenix Microme|x neo and Nanome|x neo are ideally suited for industrial highly automated X-ray electronics inspections in process and quality control, failure analysis, and R&D.

Phoenix X|act is a large and powerful image processing software to program automatic test cycles. Manual, as well as fully automated X-ray inspection, can be done easy and self-explanatory.

For manual X-ray inspection Waygate Technologies' optional Flash!™ image optimization technology enables faster, more reliable failure detection.

The Phoenix X|aminer is an easy to use entry-level microfocus X-ray inspection (AXI) system with strong performance that is designed for the special needs of the high-resolution inspection of electronic assemblies, components, and PCBA.

Due to the new combination of CMOS flat-panel detector and computed tomography (CT) the system provides significantly better signal-to-noise-ratio, sharpness, and life-imaging capability. The powerful Phoenix X|act base software for 2D and Phoenix Datos|x base for CT offers ease of use and allows manual as well as automatic inspection.

Our PlanarCT module enables users of the Phoenix Microme|x and Nanome|x automated X-ray inspection systems to perform a better, more reliable inspection of solder joints and packages in complex printed circuit board assemblies.

Performing a PlanarCT scan is easy to adjust without any sample preparation of fixing in a rotation stage. The board is just placed on the manipulation table and the region of interest scanned while the table rotates. The reconstructed PlanarCT slice or multislice views allow exact inspection results of a single plane or a whole package of interest without overlaying structures from other board areas. Our included 3D|viewer also allows full volume evaluation tasks.