High performance X-ray inspection solution

Phoenix Microme|x Neo and Nanome|x Neo

Premium nanofocus and microfocus inspection for electronics

The Phoenix Microme|x Neo and Nanome|x Neo provide high-resolution 2D X-ray technology, PlanarCT and 3D computed tomography (CT) scanning in one system. 

With innovative engineering coupled with ultra-high positioning accuracy, Phoenix Microme|x Neo and Nanome|x Neo are ideally suited for industrial X-ray electronics inspections in process and quality control for greater productivity, failure analysis for the increased safety and quality of your products, and R&D where innovations are born. Both enableautomated X-ray inspection (AXI) of electronic components - such as semiconductors, PCBs, electronic assemblies, sensors and lithium-ion batteries - in industrial, automotive, aviation and consumer electronics industries. 

Non-destructive electronics inspection starts here

Innovative and unique features and an extremeCT high positioning accuracy make both the phoenix MicromeIx 160 and 180 neo and the NanomeIx 180 neo the effective and reliable solution for a wide spectrum of 2D and 3D offline inspection tasks: R&D, failure analysis, process and quality control.   

The Phoenix|x-ray X|act inspection software offers easy to program CAD based µAXI ensuring automated inspection in the micrometer range. Another unique benefit is Waygate Technologies highly dynamic DXR flat panel detector with active cooling. Offering up to 30 frames per second, it provides outstanding brilliant live imaging and fast data acquisition for 3D CT.


  • Brilliant live inspection images due to high dynamic Waygate DXR digital detector array  
  • Unique high power 180 kV / 20 W micro- or nanofocus tube for even high absorbing electronic samples  
  • Minimized setup time due to highly efficient automated CAD programming  
  • Live overlay of CAD and inspection results even in rotated oblique inspection views  
  • Extremely high defect coverage and repeatability 
Unique Features: 
  • Superior pixel resolution (85/100µm) new detectors more competent to semiconductors and tiny electronics components inspection  
  • Ease of use: inspection report to be automatically generated after inspection  
  • X|act package for CAD based µAXI programming and automatic inspection  
  • Diamond|window for up to 2 times faster data acquisition at the same high image quality level  
  • Optionally 3D computed tomography scans within 10 seconds Shadow|target to prevent sensitive devices from radiation damage by reducing unnecessary dose   
  • Optical or X-ray navigation map for overview of large size samples and fast positioning   
  • 3 different detector options depending on the inspection task, e.g. DXR S100 Pro with 2,500 x 3,000 pixels at 100 μm pixel size for superior resolution and outstanding detectability


  • Battery inspection
  • Quality assembly
    • BGA
    • Wire sweep
    • PTH
    • QFN/QFP
  • Other components
    • IGBT
    • SMD


  • Quality assembly
  • SMT
  • Sensors
  • Control modules
Phoenix Microme|x Neo and Nanome|x Neo - Key Features
Brilliant DXR-HD live imaging

Waygate Technologies´ exclusive brilliant DXR-HD detector fleet includes:

1) The newest large-size DXR S100 Pro detector - superior pixel resolution defining industry-leading imaging technology

  • Provides superior 100 um pixel resolution and frame rates up to 30 frames per second which combines outstanding detectability with high efficiency
  • 300 mm x 250 mm large active area significantly expands the vision and redefines inspection efficiency

2) Exclusive high dynamic DXR250RT detector - enhanced scintillator technology introduces a new industry standard for efficient live inspection:

  • Full frame rate of 30 frames per second at 1000x1000 pixels offers low noise coupled with brilliant image quality ensuring fast and detailed live inspection
  • Active temperature stabilization for precise and reliable inspection results
  • Extremely fast data acquisition in 3D CT mode
  • Detail detectability down to 0.5 μm / 0.2 μm for high-performance failure analysis
Flash!Filters BGA inspection
High output with high-resolution: Diamond|window

Compared to conventional beryllium targets, the Diamond|window allows higher power at a smaller focal spot. This ensures high-resolution even at high output.

  • Up to 2 times faster CT data acquisition at the same high image quality level
  • High output with high-resolution
  • Non-toxic target
  • Improved focal spot position stability within long term measurements
  • Increased target lifetime due to less degradation with higher power density
Phoenix VTX S Diamond Window
High-resolution 3D computed tomography

For advanced inspection and 3D analysis of smaller samples, Phoenix|x-ray’s proprietary 3D CT technology is optionally available.

  • 180 kV / 20 W high power X-ray technology, fast image acquisition with DXR detector and Diamond|window combined with Phoenix|x-ray’s fast reconstruction software deliver high-quality inspection results
  • Maximum voxel resolution down to 2 microns; the nanoCT® capability of the Nanome|x allows higher image sharpness
nanoCT TSV void analysis
X|act – CAD based inspection: FLASH!™

High-resolution μAXI for extremely high defect coverage

As a solution for μAXI with extremely high defect coverage, phoenix|x-ray provides its high precision systems MicromeIx Neo and NanomeIx Neo including the unique X|act software package for fast and easy offline CAD programming.

Its intuitive new GUI with improved outstanding precision and repeatability, small views with resolutions of only a few micrometers, 360° rotation, and oblique viewing up to 70° ensures meeting the highest quality standards – even for inspection of components with a pitch of just 100 microns.

Besides automated inspection, X|act ensures an easy pad identification by its live CAD data overlay function even in manual inspection while FLASH!™ image optimization ensures high defect coverage.

phoenix x|act 2d x-ray software, inspection, ndt, ndt software, electronics inspection
Efficient CAD programming

X|act provides not only a minimal setup time compared to conventional view based AXI – once programmed, the inspection program is portable to all X|act compatible systems. The result is fast and easy programming: just assign the inspection strategies and let X|act generate the automated inspection program

  • Easy pad-based offline programming
  • Specific inspection strategies for different pad types
  • Fully automated inspection program generation
  • Extremely high positioning accuracy even at oblique viewing and rotation
  • Easy pad identification in manual X-ray inspection
  • High reproducibility on large PCBs
Nanome|x Operator
Virtual board slicing with Planar|CT

Planar|CT slice or multislice views allow exact inspection results of a single plane or a whole package

  • Easy 2D slice or 3D volume evaluation of large complex boards
  • No board cutting, no overlaying structures as in X-ray images
Cutting-edge detail detectability, speed, and image quality
  • Brilliant live inspection images with high dynamic Waygate Technologies DXR digital detector array
  • Large 27” monitor and ultra-high defect coverage and repeatability
  • Detail detectability at 0.5 µm or 0.2 µm with nanofocus
  • Live overlay of CAD and inspection results even in rotated oblique inspection views
  • High power 180 kV / 20 W microfocus or nanofocus tube for high absorbing electronic samples
BGA ball Flash optimized
Navigation Map Orientation

Clear overview and fast positioning: 

•  Optical camera image or X-ray overview image for whole sample     as navigation map •  Fast manipulation by clicking on the map •  Inspection program can be set based on the optical navigation map •  Position on the map can be saved into test report generated by X|act

AXI Navigation Map
Smart Dose Management

Waygate Technologies´ proprietary Shadow|target inside the X-ray tube enables a reduction of unnecessary radiation dose of up to 60% compared to conventional x-ray tubes during a typical inspection. Combined in a low-dose bundle together with the brand new Dose|manager tool, it enables real-time dose monitoring and controlling

This solution protects radiation sensitive inspected components from aging to worst case damage.

  • The Shadow|target is linked with the Dose|manager tool
  • Shadow|target prevents frequent generator start & stop to reduce unwanted radiation
  • Fast and stable X-ray recovering. No delay of energy running up
  • Dose measurement: Realtime visualization of projected dose through “heat map” 
  • Cumulated dose counting per inspection
In the Dose|manager tool, rainbow coloring is visualizing the projected X-ray dose in real time: Left image: Dose Map without Shadow|target. Right image: Dose Map with Shadow|target.


Dose reduction up to 60 %
Efficient and transportable for in-field applications
  • Minimized setup time due to highly efficient automated CAD programming
  • Designed for portability with compact, state-of-the-art electronics
  • Intuitive GUI interface with fully automated inspection program generation
Options for optimization and 3D scanning
  • Optional FLASH!™ image optimization technology
  • Optional advanced failure analysis with high-resolution 3D micro- or nanoCT® or large board PlanarCT
  • Optional 3D CT scans up to 10 seconds
Phoenix Microme|x Neo and Nanome|x Neo
Learn all about the Phoenix Microme|x Neo and Nanome|x Neo

Next-generation, high-resolution 2D X-ray technology and 3D computed tomography( CT) scanning

What type of tube does the Phoenix Micromex/Nanomex Neo use?

Microme|x Neo offers both a 160KV micro focus tube and a 180KV micro focus tube with Diamond|window. The Nanome|x Neo is using 180KV nano focus tube.  Detail detectability at 0.5 µm (Microme|x Neo) or 0.2 µm (Nanome|x Neo)

Micro nanofocus X-ray tube scheme
What type of detector is used?

Both the Microme|x Neo and Nanome|x Neo offer various detectors with different image area and pixel size. From CMOS detector with 191 fps to aSI detectors. From 75µm high resolution to 200µm resolution with extremely high dynamic range and brilliant image quality ensuring fast and detailed live inspection,


What is the Max. Inspection Area and the Max. Sample size?

The Max. inspection area of our system is 460 mm x 360 mm (18” x 14”) with a rotation table, and 610 mm x 510 mm (24” x 20”) without a rotation table. Max. sample size/weight is 680 mm x 635 mm (27” x 25”) / 10 kg (22 lbs.).

Can they both perform 3D inspection ?

Phoenix|x-ray’s proprietary 3D CT technology is optionally available on the Microme|x Neo and Nanome|x Neo for advanced inspection and 3D analysis of smaller samples. Max. geometric magnification could be 100x (CT) and Max. voxel resolution down to 2um, resolution depending on the sample size.

Get in touch with an expert.

Your request has been submitted.
Thank you for your interest. A specialist will be in touch with you shortly.