V|TOME|X S NEO
A compact industrial CT platform for broad coverage.
From fine-detail analysis to larger, denser components, V|tome|x S Neo adapts to a wide range of inspection needs—combining dual-tube flexibility, tailored detector performance, and a compact footprint just over 3 m² for seamless lab integration.
Max voltage
Detail detectability
Compact footprint
Max scan diameter
The Highlights
Dual|tube Technology |
Switch between penetration and precision.
Switch between 240 kV microfocus and 180 kV nanofocus with the push of a button, no recalibration needed.
0.2 µm |
|
detail detectability |
COmpact footprint |
More inspection capability in less space.
Full 2D radiography and 3D CT in just over 3 m² of footprint, with room for samples up to 400 mm in diameter and 15 kg in weight.
400 mm | |
max part dimension |
Metrology|edition | Image
|
Extend inspection into measurement.
Add CT-based dimensional measurement with Metrology|edition. Supports CAD comparison, wall thickness analysis, and reverse engineering.
VDI 2630 |
|
metrology-ready |
Detector flexibility | Image
|
Tune the platform to your task.
Choose the detector that fits your task, from higher throughput imaging to finer detail for demanding applications.
3 detector options |
|
standard · fast · high resolution |
Proprietary Technology | Image
|
Faster scans, better images.
Proprietary High|Flux target technology and high sensitivity detectors deliver superior image quality at significantly reduced scan times.
2× |
|
scan speed or resolution |
Applications
One CT inspection platform. Endless applications.
From electronics and batteries to additive manufacturing and beyond, V|tome|x S Neo is built to support a wide range of inspection needs in one compact platform. Explore the applications below to see how the platform adapts to different inspection challenges, part types, and priorities.
Inspect fine features and full assemblies. Reveal subtle internal defects, hidden connections, and structural detail across electronics workflows.
Reveal defects beyond the limits of 2D X-ray.
Quantify reliability and thermal performance risks.
Identify delamination and interfacial separation.
Verify internal alignment with clarity.
CT METROLOGY OPTION
Metrology|edition
Extend inspection into dimensional measurement.
Extend inspection into dimensional measurement with VDI/VDE 2630 conformity. Enables nominal-actual CAD comparison, wall thickness analysis, and reverse engineering, verified by Ruby|plate and Easy|calib. SD ≤ (14 + L/50) μm at any position.
VDI/VDE 2630
Dimensional CT conformity
Supports recognized dimensional measurement workflows for industrial computed tomography.
SD ≤ 14 + L/50 μm
At any position
Measurement performance designed for repeatable dimensional evaluation across the CT volume.
Ruby|plate
Verified with Easy|calib
Verification tools support confidence in calibration and metrology workflows.
SYSTEM DESIGN
Compact by design. Capable by nature.
Thoughtful by design. Proven in practice. V|tome|x S Neo brings together precision, engineering, thoughtful design, and trusted inspection performance. With a footprint of just over 3 m², V|tome|x S Neo is designed to fit more naturally into real lab spaces, with a compact form and operator-friendly layout that make advanced inspection easier to place, use, and live with every day.
DETECTOR LINEUP
More ways to optimize CT inspection.
V|tome|x S Neo offers a flexible detector lineup, giving users the freedom to configure the system around the needs of their application. Whether the priority is broader everyday capability, faster inspection, or higher-resolution CT, the platform can be tuned to deliver the right balance of coverage, speed, and detail.
VERSATILE
DXR S100 Pro
A dependable foundation for everyday inspection—balancing coverage, flexibility, and proven performance across a wide range of 2D and 3D workflows.
NEW DETECTOR OPTION
Dynamic 41|100
Wider CT coverage, without giving up detail.
The Dynamic 41|100 expands the available field of view while maintaining 100 µm pixel size, helping larger objects be imaged at the same resolution without changing system geometry. Alternatively, users can reveal finer defects without increasing geometric magnification, supporting more efficient, high-resolution inspection. The value becomes clearest in application, see the comparisons across real inspection scenarios below.
16 MP
High-resolution detector
Supports fine-detail CT inspection with a high pixel count for improved feature visibility.
100 μm
Pixel size
Helps capture small features, fine structures, and subtle defect indications across inspected parts.
1:10,000
Dynamic range
Improves visibility of low-contrast details with stronger brightness from the CsI Endurance™ scintillator.
SOFTWARE
Datos|x 3 - The future of CT, accelerated
Experience the future of industrial CT with Datos|x 3—Waygate Technologies’ exclusive software, designed for seamless data acquisition and reconstruction. Built on 20+ years of innovation, Datos|x 3 delivers an intuitive interface and up to 40% faster reconstruction.
Unlock sub-micron detail in academia, electronics, and semiconductors with advanced modules like Fast|scan and Sector|scan, making complex sample analysis effortless.
SINCE 2003
Over 20 years of innovation
The Phoenix V|tome|x S has a long heritage of pushing CT technology forward, helping manufacturers and researchers solve their most complex challenges.
Product Specifications
Detail
Data
X-ray tube type
Open directional high-power microfocus X-ray tube, closed cooling water circuit. Optional additional (open) transmission high-power nanofocus X-ray tube
Max. voltage / power
240kV/320W
Dual|tube option for nanoCT® : additional 180kV/20W high-power nanofocus tube with Diamond|window & easy tube exchange just by a push of a button
Detail detectability
Down to <1µm (microfocus tube); optional down to 0.2µm (nanofocus tube)
Min. voxel size
Down to 1µm (microfocus tube)
Optional down to <0.27µm (nanofocus tube)
Detector type (all according US ASTM E2597 standard)
Standard: DXR 100 Pro, 100 µm pixel size, 2500 x 3000 pixels
Fast imaging: Temperature stabilized Dynamic 41|200, 400 x 400 mm (16” x 16”), 200 µm pixel size, 2036 x 2036 pixels (4 MP), up to 30 fps
High resolution: Temperature stabilized Dynamic 41|100 with superior image and result quality, 400 x 400 mm (16” x 16”), 100 µm pixel size, 4048 x 4048 pixels (16 MP), extremely high dynamic range > 10000:1
Manipulation
5-axes metal precision manipulator, optimized construction for high mechanical stability
Focus-detector-distance
850 mm (Dynamic 41|100 & 41|200) & 874 mm (DXR 100 Pro)
Max. 3D scan dimensions
Up to 400 mm Ø x 360 mm with optional Offset|CT (Dynamic 41|100 & 41|200)
Up to 400 mm Ø x 350 mm with optional Offset|CT (DXR 100 Pro)
Max. sample dimensions
Up to 400 mm Ø x 400 mm
Max. sample weight
10kg (22lbs.), optional 15kg (33lbs)
System dimensions W x H x D
2,550 mm x 1,905 mm x 1,275 mm (100,4” x 75” x 50,2”)
System weight
Appr. 4,050 kg / 8,990 lbs. (without ext. components)
Temperature stabilization
Active X-ray tube cooling & temperature stabilized detector
Measuring Accuracy
Specification at VDI/VDE 2630 positions: (14+L/50 mm) µm
Specification for any other position: (14+L/50 mm) µm with Easy|calib
No additional options are needed. The V|tome|x S Neo already includes the manipulator tilt axis (+/-45°) and the X|act NDT software for autopositioning (CNC), manual measurement, automated inspection and digital image processing in the standard version. Max. 10 kg sample load (limited due to tilt mode).
V|tome|x S Neo can be ordered in a Dual|tube configuration. This setup expands the application range significantly and allows the user a fast and easy switch between 240 kV/ 320 W microfocus X-ray tube and 180 kV / 20 W nanofocus tube, just by a push of a button – no calibration needed. Upgrade of 2nd tube in the field is also possible.
The highest-resolution detector option is the new Dynamic 41|100. Its industry-leading 100 µm pixel size delivers the finest detector resolution in the V|tome|x S Neo portfolio, while the large 400 × 400 mm imaging area helps maintain field of view for efficient high-detail inspection.
- Click & Measure for full automated CT execution
- Measurement package (incl. Surface|extraction, Easy|calib)
- Offset|scan (For wide objects exceeding the field of view)
- Helix|CT (Helical scan trajectory for improved data quality)
- ASC|filter (Advanced noise reduction filters)
- Scatter|correct (blur and streak artifacts reduction on high absorbing materials)
- Voxel|calib (Full automated procedure to calibrate Metrology|edition CT)
- BHC|multi (Advanced correction for ‘cupping’ and ‘streaking’ artifacts)
- Flex|scan (Flexible scanning trajectory for high aspect ratio samples)
- Auto Pixel Mask (Automatic detection and correction of defect lines & pixels)
- Scatter|reduce (Scatter artifacts reduction)
- Burn|In (Automatic check for potential target burn-in)
