Phoenix V|tome|x L 450

Phoenix V|tome|x L450

Advanced minifocus CT scanning at the limits of sample size and density

As the next technical expansion stage of the Phoenix V|tome|x L300 system, the Phoenix V|tome|x L450 provides even more flexibility, sample size and with its 450 kV / 1500 W minifocus and its optional 300 kV microfocus X-ray tube more penetration power to make it an excellent solution for void and flaw detection and 3D metrology of castings, large assemblies and AM parts.



Minifocus 2D and 3D CT Scanning with maximum flexibility starts here 
Phoenix V|tome|x L 450
Phoenix V|tome|x L 450

 

The Phoenix V|tome|x L450 is a large versatile minifocus system for 2D and 3D computed tomography and 2D non-destructive X-ray inspection. With its granite-based manipulation it is handling even large samples with high precision. The system is an excellent solution for void and flaw detection e.g. of castings or additive manufactured parts as well as 3D metrology conform to VDI/VDE 2630-1.3. An optional second 300 kV microfocus X-ray tube combined with an optional High-flux|target allows the Phoenix V|tome|x L450 to adapt to any kind of industrial and scientific CT application.

Highlights

Highlights


User Benefits

  • Great flexibility for 2D and 3D inspection on a wide application range
  • Fast CT acquisition and brilliant images by next generation highly sensitive Dynamic 41 detectors
  • Leading exclusive Waygate Technologies core components such as X-ray tubes, detectors, software
  • Excellent software modules for highest CT quality and ease of use
  • High throughput cone scatter fan beam CT
  • Dimensional measuring with extremely high precision, reproducibility, and user-friendliness
  • Failure detection and reproducible 3D metrology of steel parts and large aluminium castings
  • Leading measurement accuracy referring to VDI/VDE 2630-1.3 for reliable revalidation of system performance and reproducible metrology applications
Key Features

  • Mini-/microfocus Dual|tube configuration
  • Long-life|filament
  • Scatter|correct technology
  • Dynamic|41 technology detector
  • Helix|CT
  • Offset|CT
  • Multi|bhc
  • Metrology|edition
  • Ruby|plate
Applications

  • High precision micro- and minifocus CT
  • Large Light alloys: Aluminum, Magnesium, Zinc (e.g. E-engine housings, gear boxes, large structure parts)
  • Higher density alloys: Iron castings, titanium, nickel, cobalt
  • Composite materials, large assemblies, AM parts
  • Research: 3D printing, composites, battery cells and modules, ceramics, medical industry
  • Reverse engineering: Metal, plastics, rapid prototyping, biomechanics
  • Scientific research (plants, archaeology, animals, cultural, geo- and materials sciences)

Phoenix V|tome|x L 450 Features

Phoenix V|tome|x L450 Features
Mini-/microfocus Dual|tube configuration
Long-life|filament
  • Up to 10 times increased filament lifetime, ensuring long-term stability and optimizing system efficiency by Long-life|filament (optionally)
Dynamic|41 technology detector
  • Double CT resolution at the same speed, or double throughput at the same quality level as 200 µm pitch DXR detectors. Compared to 16-bit detectors, the optimized 14-bit technology offers the highest efficiency with a dynamic range of 10000:1 and thus saves time in use and also generates less noise in the image
Helix|CT
  • Scan with improved image quality to increase probability of detection (POD) with efficiency and ease
Offset|CT
  • Scan even larger parts with up to ~70% larger scanning volume
Multi|bhc
  • The Multi|bhc tool corrects streaking artifacts which typically occur as multiple dark streaking bands positioned between dense areas in multi-material samples
Metrology|edition

As part of the optional Metrology|edition, The Ruby|plate calibration phantom and the compensation of thermal drift effects based on the use of temperature sensors enable automated measurement sequences and precision to a new level of performance for even larger parts. The system guarantees a measurement accuracy of SD ≤ (6.8 ± L/100 mm) µm according to VDI/VDE 2630-1.3 for reliable three times faster revalidation of the system performance and reproducible measurement applications like:

  • Nominal-actual CAD comparison
  • Dimensional measurements / wall thickness analysis
  • Reverse Engineering/Tool Compensation
High-flux|target (optional)

Improve efficiency with faster microCT scans or doubled resolution with higher power on a smaller focal spot

Technical Specifications

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